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US Patent Issued to KYOCERA on July 14 for "Wiring board and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,684, issued on July 14, was assigned to KYOCERA Corp. (Kyoto, Japan). "Wiring board and electronic device" was invented by Yoshiki Kawazu (... Read More


US Patent Issued to Intel on July 14 for "Cooling assembly with dampened oscillation response" (Washington, Oregon Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,685, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Cooling assembly with dampened oscillation response" was invent... Read More


US Patent Issued to IBIDEN on July 14 for "Wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,686, issued on July 14, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Masataka Kato (Ogaki, Japan), Sh... Read More


US Patent Issued to Intel on July 14 for "Circuit apparatus for electronic devices" (Malaysian, Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,687, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Circuit apparatus for electronic devices" was invented by Jeff ... Read More


US Patent Issued to TDK on July 14 for "Electronic component embedded substrate and manufacturing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,688, issued on July 14, was assigned to TDK Corp. (Tokyo). "Electronic component embedded substrate and manufacturing method therefor" was ... Read More


US Patent Issued to Honeywell Federal Manufacturing & Technologies on July 14 for "Transparent package for use with printed circuit boards" (Missouri Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,689, issued on July 14, was assigned to Honeywell Federal Manufacturing & Technologies LLC (Kansas City, Mo.). "Transparent package for use... Read More


US Patent Issued to PANELSEMI on July 14 for "Electronic device" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,690, issued on July 14, was assigned to PANELSEMI Corp. (New Taipei City, Taiwan). "Electronic device" was invented by Chin-Tang Li (New Ta... Read More


US Patent Issued to VueReal on July 14 for "Selective transfer of micro devices" (Canadian Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,691, issued on July 14, was assigned to VueReal Inc. (Waterloo, Canada). "Selective transfer of micro devices" was invented by Gholamreza C... Read More


US Patent Issued to FANUC on July 14 for "Printed circuit board and dynamic brake circuit comprising same" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,692, issued on July 14, was assigned to FANUC Corp. (Yamanashi, Japan). "Printed circuit board and dynamic brake circuit comprising same" w... Read More


US Patent Issued to SEIKO EPSON on July 14 for "Sensor module" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,693, issued on July 14, was assigned to SEIKO EPSON Corp. (Japan). "Sensor module" was invented by Hitoshi Ueno (Shiojiri, Japan). Accordi... Read More